Three-dimension circuit structure and semiconductor device
US8933563B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2012 |
| Grant date | Jan 13, 2015 |
| Priority date | — |
| Expiry date | Dec 6, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6739
Abstract
A three-dimension circuit structure includes a substrate, a first conductive layer, a filled material and a second conductive layer. The substrate has an upper surface and a cavity located at the upper surface. The first conductive layer covers the inside walls of the cavity and protrudes out the upper surface. The filled material fills the cavity and covers the first conductive layer. The second conductive layer covers the filled material and a portion of the first conductive layer, and the first conductive layer and the second conductive layer encapsulate the filled material. The material of the filled material is different from that of the first conductive layer and the second conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.