Composition for forming high dielectric film for film capacitor
US8934216B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2009 |
| Grant date | Jan 13, 2015 |
| Priority date | — |
| Expiry date | May 27, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a high dielectric film for a film capacitor obtained by molding a film forming composition for a film capacitor comprising a thermoplastic resin (A) and surface-treated high dielectric inorganic particles (B) obtained by treating the surfaces of high dielectric inorganic particles (b1) having a dielectric constant (20° C., 1 kHz) of 100 or more with a low dielectric compound (b2) having a dielectric constant (20° C., 1 kHz) of 10 or less. This high dielectric film for a film capacitor can restrain the decrease of electrical insulating property, in spite of the high dielectric inorganic particles being dispersed at a high filling rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.