Thermal dissipator utilizing laminar thermal transfer member
US8934248B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Mar 4, 2010 |
| Grant date | Jan 13, 2015 |
| Priority date | — |
| Expiry date | Aug 10, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermal dissipator includes an elongated laminar thermal transfer member having opposite sides, opposite ends and a longitudinal axis extending between those ends. The member has a thermal conductivity along its axis and in a first plane extending between its sides that is substantially greater than the thermal conductivity of the member in a second plane transverse to the first plane. A transverse heat sink structure contacts at least one side of the thermal transfer member along the length thereof, and extends from the thermal transfer member in a direction parallel to the first plane. A compression device compresses the thermal transfer member and the heat sink structure together to establish intimate thermal contact therebetween. Solid state lighting apparatus incorporating the dissipator is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.