Thermal distribution systems and methods
US8936072B2 · kind B2 · utility
8Cited by
10References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 11, 2010 |
| Grant date | Jan 20, 2015 |
| Priority date | — |
| Expiry date | Jan 18, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Thermal distribution systems and methods are provided. A thermal distribution system can include a first surface having a perimeter and a second surface. At least a portion of the perimeter can be disposed proximate the second surface, forming a void between the first and second surfaces. The first surface can include a plurality of perforations. The second surface can include at least a portion of an electronic enclosure. A fluid mover having a first inlet can be adapted to draw a first inlet fluid from inside the void.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.