Wafer level lens, production method of wafer level lens, and imaging unit
US8936371B2 · kind B2 · utility
4Cited by
0References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 16, 2014 |
| Grant date | Jan 20, 2015 |
| Priority date | — |
| Expiry date | May 16, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B13/001
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A sufficient light-shielding property is obtained by a wafer level lens having at least one lens module having a substrate and a plurality of lenses formed on the substrate in which the wafer level lens has a black resist layer formed on the surface of the lens module or on the surface of the substrate and the black resist layer is formed with a pattern having an opening at a part intersecting the optical axis of the lens, and generation of defects such as ghosts, flares and the like due to a reflected light can be prevented and an increase in the production cost can be suppressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.