Mold assembly with integrated melting device
US8936457B2 · kind B2 · utility
0Cited by
12References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2011 |
| Grant date | Jan 20, 2015 |
| Priority date | — |
| Expiry date | Jun 21, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/1685
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A platen-supported system (105) for use with a molding-system platen structure (107), the platen-supported system (105) comprising: a frame assembly (103) connectable with the molding-system platen structure (107); and at least one plasticating device (201) supported by the frame assembly (103). A molding system (100) having a mold frame assembly (203) configured for supporting a molding assembly (200), and the at least one plasticating device (201) located within the mold assembly (200).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.