Integratable assisted cooling system for precision extrusion deposition in the fabrication of 3D scaffolds
US8936742B2 · kind B2 · utility
1Cited by
8References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2011 |
| Grant date | Jan 20, 2015 |
| Priority date | — |
| Expiry date | Oct 1, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2948/92942
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention relates to an integrated Assisting Cooling (AC) device, system and method for use with PED devices, allowing use of biopolymers having higher melting points in the fabrication of 3D scaffolds. The AC device cools the filament as it is extruding from the nozzle via low flow convective cooling. The AC device allows for cooling in the +/− direction of motion on an XY plane. The AC device elevates with the material delivery chamber. The AC device allows for scaffold fabrication at applied temperatures as high as about 250° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.