Photocurable resin composition containing fluorine and method for producing a resin mold using same
US8936744B2 · kind B2 · utility
1Cited by
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4Claims
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Key dates
| Filing date | Jul 7, 2010 |
| Grant date | Jan 20, 2015 |
| Priority date | — |
| Expiry date | Dec 25, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24479
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
There are provided a fluorine-containing photocurable resin composition and a method of preparing a mold comprising the same and more particularly, a photocurable resin composition having chemical resistance, mechanical properties and high transmittance, etc. as well as being easily wetted with and released from thermosetting or photocurable resins for pattern formation regardless of additional surface treatment, as opposed to the existing polymer resin materials used for resin molds, and a method of preparing a resin mold using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.