Electroless plating method
US8936890B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2013 |
| Grant date | Jan 20, 2015 |
| Priority date | — |
| Expiry date | Nov 5, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/405
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A pattern is formed in a polymeric layer comprising (a) a reactive polymer comprising -A- recurring units comprising pendant tertiary alkyl ester groups, (b) a compound that provides an acid upon exposure to radiation having a λmax of 150 nm to 450 nm, and (c) a crosslinking agent that is capable of reacting in the presence of the acid to provide crosslinking in the (a) reactive polymer. The polymeric layer is patternwise exposed to the radiation to provide a polymeric layer comprising exposed regions comprising a polymer comprising carboxylic acid groups. The exposed regions are contacted with a reducing agent to incorporate reducing agent, and then contacted with electroless seed metal ions to oxidize the reducing agent and to form corresponding electroless seed metal nuclei. The electroless seed metal nuclei are then electrolessly plated with a metal to form a conductive metal pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.