Curable reaction resin system
US8937128B2 · kind B2 · utility
1Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2009 |
| Grant date | Jan 20, 2015 |
| Priority date | — |
| Expiry date | Aug 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable reaction resin system can be used for example as a casting compound, molding compound, or high-temperature resin, and is to be processed as a two-component compound. The system has a first reaction resin component and a second reaction resin component, the first reaction resin component being epoxy-free and realized on the basis of a cyanate ester.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.