Patent · US Active

Curable reaction resin system

US8937128B2 · kind B2 · utility

1Cited by
1References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 22, 2009
Grant dateJan 20, 2015
Priority date
Expiry dateAug 18, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A curable reaction resin system can be used for example as a casting compound, molding compound, or high-temperature resin, and is to be processed as a two-component compound. The system has a first reaction resin component and a second reaction resin component, the first reaction resin component being epoxy-free and realized on the basis of a cyanate ester.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.