Package-on-package proximity sensor module
US8937377B2 · kind B2 · utility
1Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2010 |
| Grant date | Jan 20, 2015 |
| Priority date | — |
| Expiry date | Jan 9, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/4917
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A package-on-package proximity sensor module including a infrared transmitter package and a infrared receiver package is presented. The proximity sensor module may include a fully-assembled infrared transmitter package and a fully-assembled infrared receiver package disposed on a quad flat pack no-lead (QFN) lead frame molded with an IR cut compound housing. A bottom surface of the QFN lead frame may be etched and covered with the IR cut compound to provide a locking feature between the QFN lead frame and the IR cut compound housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.