Patent · US Active

Thermal management of integrated circuits using phase change material and heat spreaders

US8937384B2 · kind B2 · utility

38Cited by

9References

31Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Zhongping Bao · San Diego, US
James D. Burrell · San Diego, US
Liang Cheng · Beijing, CN

Key dates

Filing date	Apr 25, 2012
Grant date	Jan 20, 2015
Priority date	—
Expiry date	Aug 2, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/73253
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

At least one feature pertains to an apparatus having passive thermal management that includes an integrated circuit die, a heat spreader thermally coupled to the integrated circuit die, a phase change material (PCM) thermally coupled to the heat spreader, and a molding compound that encases the heat spreader and the PCM. In one example, the heat spreader may include a plurality of fins, and at least a portion of the PCM is interposed between the plurality of fins. Another feature pertains to an apparatus that includes an integrated circuit die, and a molding compound having a phase change material intermixed therein. The resulting molding compound completely encases the die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.