Compound barrier layer, method for forming the same and package structure using the same
US8937394B2 · kind B2 · utility
3Cited by
4References
19Claims
0Family size
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Key dates
| Filing date | Dec 27, 2012 |
| Grant date | Jan 20, 2015 |
| Priority date | — |
| Expiry date | Dec 27, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment of the invention provides a compound barrier layer, including: a first barrier layer disposed on a substrate; and a second barrier layer disposed on the first barrier layer, wherein the first barrier layer and second barrier layer both include a plurality of alternately arranged inorganic material regions and organo-silicon material regions and the inorganic material regions and the organo-silicon material regions of the first barrier layer and second barrier layer are alternatively stacked vertically.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.