Patent · US Active

Mechanical resonating structures including a temperature compensation structure

US8937425B2 · kind B2 · utility

5Cited by

38References

16Claims

0Family size

Assignee

Sand 9, Inc. · US

Inventors

David M. Chen · Brookline, US
Jan H. Kuypers · Cambridge, US
Alexei Gaidarzhy · Watertown, US
Guiti Zolfagharkhani · Watertown, US

Key dates

Filing date	Dec 7, 2011
Grant date	Jan 20, 2015
Priority date	—
Expiry date	Dec 7, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH03H9/02448
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations. The compensating structure may have multiple layers, one of which may have a stiffness that increases with increasing temperature and one of which may have a stiffness that decreases with increases in temperature.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.