Solderless surface mount fuse
US8937524B2 · kind B2 · utility
4Cited by
53References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2009 |
| Grant date | Jan 20, 2015 |
| Priority date | — |
| Expiry date | Dec 10, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49107
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A surface mount fuse in one embodiment includes an insulative body, first and second conductive and caps attached to the insulative body, each end cap defining an aperture, and a fuse element extending (i) through the insulative body and the apertures and (ii) along outside surfaces of the first and second conductive end caps in such a way that solder used to attach the first and second conductive end caps to an external medium also fastens the fuse element to the first and second end caps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.