Electronic assembly with detachable coolant manifold and coolant-cooled electronic module

US8937810B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Thomas J. Brunschwiler · Thalwil, CH
• Evan G. Colgan · Chestnut Ridge, US
• Michael J. Ellsworth, Jr. · Poughkeepsie, US
• Werner Escher · Düsseldorf, DE
• Ingmar G. Meijer · Zürich, CH
• Stephan Paredes · Thalwil, CH
• Gerd Schlottig · Thalwil, CH
• Martin Witzig · Horgen, CH
• Jeffrey A. Zitz · Poughkeepsie, US

Key dates

• Filing date: Sep 14, 2012
• Grant date: Jan 20, 2015
• Expiry date: Jul 16, 2033

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49002
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module.