Color-based linear three dimensional acquisition system and method
US8939074B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 12, 2013 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Apr 25, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0817
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method for capturing three-dimensional image data for inspection, alignment and operations of a material applicator includes an imaging system configured to capture three-dimensional image data of an electronic substrate. The imaging system includes one or more illumination assembly configured to project a spectrum of light substantially along a first axis at an angle to the surface of the electronic substrate. The imaging system further includes an image sensor assembly configured to detect the spectrum of light reflected from an electronic substrate surface, with the image sensor assembly including a viewing plane. The material application includes a controller that is coupled to the imaging system. The controller is configured to control movement of the imaging system and to communicate with the image sensor assembly to produce a three-dimensional image of the topology of the electronic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.