Polycrystalline silicon portion and method for breaking a silicon body
US8939336B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2012 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Jun 19, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/10
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention relates to a polycrystalline silicon portion having at least one fracture surface or cut surface, which includes metal contamination of from 0.07 ng/cm2 to 1 ng/cm2. The invention also relates to a method for breaking a silicon body, preferably a rod of polycrystalline silicon, including the steps: a) determining the lowest natural bending frequency of the silicon body; b) exciting the silicon body in its lowest natural bending frequency by means of an oscillation generator, the excitation being carried out at an excitation point of the silicon body such that the silicon body breaks at the excitation point; so that a silicon portion having a fracture surface results which includes metal contamination of from 0.07 ng/cm2 to 1 ng/cm2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.