Methods and systems for forming flexible multilayer structures
US8940117B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 13, 2008 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Mar 19, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1039
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Techniques are described for fabricating multilayer structures having arrays of conducting elements or apertures in a conductive grid which can be used to form frequency selective surfaces (FSSs), antenna arrays and the like on flexible substrates. Fabrication techniques can include use of a polymer mask or direct dielectric molding. In embodiments utilizing a polymer mask, a temporary 3D polymeric relief pattern is formed on a substrate and used as a mask or stencil to form the desired pattern elements. In an additive process, the conductive material is deposited over the masked surface. Deposition can be followed by mask removal In the subtractive process, the conductive layer can be deposited prior to formation of the polymer mask, and the exposed parts of the underlying conductive layer can be etched. Other embodiments utilize dielectric molding in which the molded structure itself becomes an integral and permanent part of the FSS structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.