Method of fabricating an integrated orifice plate and cap structure
US8940559B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2011 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Mar 31, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1645
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
In an embodiment, a method of fabricating an integrated orifice plate and cap structure includes forming an orifice bore on the front side of a product wafer, coating side walls of the orifice bore with a protective material, grinding the product wafer from its back side to a final thickness, forming a first hardmask for subsequent cavity formation, forming a second hardmask over the first hardmask for subsequent descender formation, forming a softmask over the second hardmask for subsequent convergent bore formation, etching a latent convergent bore using the softmask as an etch delineation feature, etching a descender using the second hardmask as an etch delineation feature, and anisotropic etching of convergent bore walls and cavities using the first hardmask as an etch delineation feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.