Thermosetting polymer-based composite materials
US8940827B2 · kind B2 · utility
0Cited by
15References
30Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 30, 2009 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Sep 27, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/019
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a lead-free, non-toxic and arc resistant composite material having a thermosetting polymer, at least one heavy particulate filler, at least one light particulate filler and, optionally, at least one arc resistant filler. The composite material may be utilized in manufacturing articles used in radiation shielding and other applications where arc resistant and dielectric strength are desired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.