Three dimensional passive multi-component structures
US8942002B2 · kind B2 · utility
0Cited by
9References
14Claims
0Family size
Inventors
Key dates
| Filing date | Aug 27, 2012 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Aug 27, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.