Low cost, high strength electronics module for airborne object
US8942005B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 21, 2009 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Aug 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2018
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An electronics module is provided for utilization onboard an airborne object. In one embodiment, the electronics module includes a housing having a cavity therein, a first printed circuit board (PCB) disposed in the cavity, a second PCB disposed in the cavity above the first PCB, and a supportive interconnect structure. The supportive interconnect structure includes a substantially annular insulative body and a plurality of vias. The substantially annular insulative body extends around an inner circumferential portion of the housing between the first PCB and the second PCB to support the second PCB and to axially space the second PCB from the first PCB. The plurality of vias is formed through the substantially annular insulative body and electrically couples the first PCB to the second PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.