Method and apparatus for chip cooling
US8944151B2 · kind B2 · utility
26Cited by
20References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 2008 |
| Grant date | Feb 3, 2015 |
| Priority date | — |
| Expiry date | Jan 22, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.