Plating method
US8945362B2 · kind B2 · utility
0Cited by
30References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2009 |
| Grant date | Feb 3, 2015 |
| Priority date | — |
| Expiry date | Jan 14, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.