Implantable medical electrical device connector module assemblies and methods
US8945451B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2012 |
| Grant date | Feb 3, 2015 |
| Priority date | — |
| Expiry date | Apr 15, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/753
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods for forming an insulative body of an implantable medical device connector module assembly employ an injection molding process, whereby first and second shots of insulative material form core and an overlay portions, respectively. In some methods, a panel portion of an electrical component is mounted between opposing surfaces of a mold such that a finger-like portion of the component extends into a cavity of the mold, with a first side thereof touching another surface of the mold and a second, opposite side exposed within the cavity; following first shot injection, the core portion captures the finger-like portion in relatively rigid relation thereto. When two types of connector bores are formed, a color indicator may be engaged with a feature of the core portion that is located in proximity to a connector bore of the first type, and then the overlay portion is formed over the indicator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.