Electronic device manufacture using low-k dielectric materials
US8945677B2 · kind B2 · utility
2Cited by
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18Claims
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Key dates
| Filing date | Jan 25, 2012 |
| Grant date | Feb 3, 2015 |
| Priority date | — |
| Expiry date | Jun 30, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Materials and methods for manufacturing electronic devices and semiconductor components using low dielectric materials comprising polyimide based aerogels are described. Additional methods for manipulating the properties of the dielectric materials and affecting the overall dielectric property of the system are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.