Ethylene resin composition, sealing material for solar cell, and solar cell module utilizing the sealing material
US8945701B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2010 |
| Grant date | Feb 3, 2015 |
| Priority date | — |
| Expiry date | Sep 6, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24504
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An ethylene resin composition is provided which has excellent properties including adhesion properties, electrically insulating properties, transparency, moldability and process stability and can be produced without requiring any cross-linking procedure if necessary to improve productivity; and others. The ethylene resin composition contains a modified product produced by modifying an ethylene polymer (A) that meets all of the requirements a) to e) mentioned below with an ethylenically unsaturated silane compound (B). a) The density is 900 to 940 kg/m3. b) The melting peak temperature is 90 to 125 ° C. as determined by DSC. c) The melt flow rate (MFR2) is 0.1 to 100 g/10 minutes as measured at 190 ° C. and a load of 2.16 kg in accordance with JIS K-6721. d) The Mw/Mn ratio is 1.2 to 3.5. e) The content of metal residues is 0.1 to 50 ppm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.