Patent · US Active

Interconnection method for a micro-imaging device

US8945977B2 · kind B2 · utility

0Cited by

4References

18Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Umberto Rossini · Voiron, FR
Thierry Flahaut · Le Pont-de-Claix, FR

Key dates

Filing date	Oct 8, 2013
Grant date	Feb 3, 2015
Priority date	—
Expiry date	Oct 8, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A method for producing an opto-microelectronic micro-imaging device includes a step of forming a first functional part on the base of a first substrate, a base layer, and first electric connection pad. The first functional part is transferred onto a second substrate. The first substrate is thinned until the base layer is reached. A second functional part is formed on the base layer. One via is connected to the first electric connection pad and through the first functional part. The step of forming the second functional part includes connecting the via with the second electric connection pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.