Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US8946333B2 · kind B2 · utility
36Cited by
47References
58Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2013 |
| Grant date | Feb 3, 2015 |
| Priority date | — |
| Expiry date | Mar 14, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2996
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a metal oxide, and a silane. The filler composition can further comprise other filler components including, for example, glass fiber or glass flake. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.