Low molecular weight polystyrene resin and methods of making and using the same
US8946365B2 · kind B2 · utility
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90References
14Claims
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Key dates
| Filing date | Jan 14, 2013 |
| Grant date | Feb 3, 2015 |
| Priority date | — |
| Expiry date | Jan 14, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J153/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A low z-average molecular weight, high softening point polystyrene resin having a narrow molecular weight distribution, as well as methods of making and using the same, are provided. The use of an inert solvent and/or the order of addition of reactants during polymerization may contribute to the unique properties of the final homopolymeric resin. The polystyrene resin can be partially or fully hydrogenated and may have particular use as a tackifying agent in a variety of hot melt adhesive and rubber compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.