Solar module bonding method integrated into a pan structure
US8946542B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2012 |
| Grant date | Feb 3, 2015 |
| Priority date | — |
| Expiry date | May 5, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A pan structure for bonding solar modules installed on a target position is provided. The pan structure includes a plate member configured to be disposed across a spacing between two rail structures for mounting one or more solar modules. Additionally, the pan structure includes a pair of edge members configured to couple the plate member respectively with the two rail structures. Each of the pair of edge members has a first ledge characterized to be electrically conductive and configured to be supported by one of the two rail structures and a second ledge connected the first ledge to the plate member to keep the plate member a distance below the first ledge. Moreover, the pan structure includes a plurality of contact elements spatially distributed along the first ledge for bonding both the one or more solar modules and the rail structures for electric grounding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.