Semiconductor arrangement and method for producing a semiconductor arrangement
US8946885B2 · kind B2 · utility
2Cited by
5References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 13, 2009 |
| Grant date | Feb 3, 2015 |
| Priority date | — |
| Expiry date | Sep 5, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor arrangement includes a ceramic mount and at least one semiconductor component fixed-to the ceramic mount. The ceramic mount includes a first section, and the first section is electrically conductive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.