Microphone with backplate having specially shaped through-holes
US8948419B2 · kind B2 · utility
5Cited by
6References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 4, 2010 |
| Grant date | Feb 3, 2015 |
| Priority date | — |
| Expiry date | Mar 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A MEMS microphone has 1) a backplate with a backplate interior surface and a plurality of through-holes, and 2) a diaphragm spaced from the backplate. The diaphragm is movably coupled with the backplate to form a variable capacitor. At least two of the through-holes have an inner dimensional shape (on the backplate interior surface) with a plurality of convex portions and a plurality of concave portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.