Via density and placement in radio frequency shielding applications

US8948712B2 · kind B2 · utility

Assignee

• Skyworks Solutions, Inc. · US

Inventors

• Howard E. Chen · San Jose, US
• Matthew Sean Read · Rancho Santa Margarita, US
• Hoang Mong Nguyen · Irvine, US
• Anthony James LoBianco · Irvine, US
• Guohao Zhang · Irvine, US
• Dinhphuoc Vu Hoang · Anaheim, US

Key dates

• Filing date: May 31, 2012
• Grant date: Feb 3, 2015
• Expiry date: Jan 4, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/09618
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data.