Micromechanical angular acceleration sensor and method for measuring an angular acceleration
US8950258B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2012 |
| Grant date | Feb 10, 2015 |
| Priority date | — |
| Expiry date | Mar 13, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/302
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromechanical angular acceleration sensor for measuring an angular acceleration is disclosed. The sensor includes a substrate, a seismic mass, at least one suspension, which fixes the seismic mass to the substrate in a deflectable manner, and at least one piezoresistive and/or piezoelectric element for measuring the angular acceleration. The piezoresistive and/or piezoelectric element is arranged in a cutout of the seismic mass. A corresponding method and uses of the sensor are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.