Patent · US Active

Micromechanical angular acceleration sensor and method for measuring an angular acceleration

US8950258B2 · kind B2 · utility

0Cited by
13References
19Claims
0Family size

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Key dates

Filing dateMay 24, 2012
Grant dateFeb 10, 2015
Priority date
Expiry dateMar 13, 2033

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10N30/302
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A micromechanical angular acceleration sensor for measuring an angular acceleration is disclosed. The sensor includes a substrate, a seismic mass, at least one suspension, which fixes the seismic mass to the substrate in a deflectable manner, and at least one piezoresistive and/or piezoelectric element for measuring the angular acceleration. The piezoresistive and/or piezoelectric element is arranged in a cutout of the seismic mass. A corresponding method and uses of the sensor are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.