Polycrystalline diamond compacts with partitioned substrate, polycrystalline diamond table, or both
US8950519B2 · kind B2 · utility
14Cited by
63References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2011 |
| Grant date | Feb 10, 2015 |
| Priority date | — |
| Expiry date | Sep 24, 2032 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16C2352/00
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments may include at least one stress relieving partition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.