Chemical mechanical polishing conditioner

US8951099B2 · kind B2 · utility

Assignees

• SAINT-GOBAIN ABRASIVES, INC. · US
• SAINT-GOBAIN ABRASIFS · FR

Inventors

• Jianhui Wu · Chengdu, CN
• Richard W. J. Hall · Southborough, US
• Eric M. Schulz · Worcester, US
• Srinivasan Ramanath · Holden, US

Key dates

• Filing date: Aug 31, 2010
• Grant date: Feb 10, 2015
• Expiry date: Jun 22, 2031

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24D3/14
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A chemical mechanical polishing (CMP) conditioner includes a ceramic substrate having a major surface, and an abrasive coating overlying the major surface. The major surface can include micro-protrusions arranged in a curved pattern. Alternatively, the micro-protrusions can be arranged in an irregular pattern.