Method of transfer by means of a ferroelectric substrate
US8951809B2 · kind B2 · utility
1Cited by
22References
22Claims
0Family size
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Key dates
| Filing date | Apr 3, 2009 |
| Grant date | Feb 10, 2015 |
| Priority date | — |
| Expiry date | Mar 3, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of carrying out a transfer of one or more first components or of a first layer onto a second substrate including: a) application and maintaining, by electrostatic effect, of the one or more first components or of the first layer, on a first substrate, made of a ferroelectric material, electrically charged, b) placing in contact, direct or by molecular adhesion, and transfer of the components or the layer onto a second substrate, and c) dismantling of the first substrate, leaving at least one part of the components or the layer on the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.