Controlling thermal interface material bleed out
US8951846B2 · kind B2 · utility
2Cited by
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21Claims
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Assignee
Inventors
Key dates
| Filing date | May 31, 2012 |
| Grant date | Feb 10, 2015 |
| Priority date | — |
| Expiry date | May 31, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An extended preform of a thermal interface material (TIM) is formed between a heat spreader and a die on a substrate. The preform has an extension beyond a footprint of the die. The preform is cured. A bleed out of the TIM is controlled by the extension upon curing of the preform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.