Molded EMI and thermal shield
US8952272B2 · kind B2 · utility
5Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2012 |
| Grant date | Feb 10, 2015 |
| Priority date | — |
| Expiry date | Sep 28, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0032
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One embodiment of a molded shield can include a cavity to conform to and receive an electrical component, a slit to conform to and receive a metal frame and a metal layer coupled to the top and lateral sides of the molded shield. In one embodiment, the molded shield can be formed from silicon and can include material to enhance electrical conductivity. The molded shield can couple to the metal frame which in turn can be coupled to ground with the resulting configuration acting to reduce electrical emissions. The molded shield can transfer heat away from the electrical component through conduction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.