Integrated circuit combination of a target integrated circuit and a plurality of cells connected thereto using the top conductive layer
US8952473B2 · kind B2 · utility
0Cited by
8References
6Claims
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Key dates
| Filing date | Oct 11, 2011 |
| Grant date | Feb 10, 2015 |
| Priority date | — |
| Expiry date | Jan 5, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A target integrated circuit (TIC) having a top conductive layer (TCL) that may be connected to a plurality of cells that are further integrated over the TIC. Each of the plurality of cells comprises two conductive layers, a lower conductive layer (LCL) below the cell and an upper conductive layer (UCL) above the cell. Both conductive layers may connect to the TCL of the TIC to form a super IC structure combined of the TIC and the plurality of cells connected thereto. Accordingly, conductivity between the TIC as well as auxiliary circuitry to the TIC maybe achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.