Semiconductor packages and methods of manufacturing the same
US8952549B2 · kind B2 · utility
1Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2012 |
| Grant date | Feb 10, 2015 |
| Priority date | — |
| Expiry date | May 18, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06562
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package comprises a board including a board pad, a plurality of semiconductor chips mounted on the board, the semiconductor chips including chip pads. Bumps are disposed on the chip pads, respectively, and a wire is disposed between the chip pads and the bumps. The wire electrically connects the chip pads of the plurality of semiconductor chips and the board pad to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.