Patent · US Active

Low profile camera module packaging

US8953088B2 · kind B2 · utility

0Cited by

1References

15Claims

0Family size

Inventors

Prebesh Pavithran · Bukit Mertajam, MY
Yeow Thiam Ooi · Butterworth, MY
Khen Ming Goh · Kepong, MY
Kumareson Darmalingam · Air Itam, MY

Key dates

Filing date	Feb 23, 2012
Grant date	Feb 10, 2015
Priority date	—
Expiry date	May 4, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4913
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A camera module including an image sensor and a circuit substrate that are each attached to a bottom surface of a glass substrate. The image sensor is positioned between the circuit substrate and the glass substrate. This arrangement allows passive components normally associated with the image sensor to be mounted to a top surface of the glass substrate rather than to the image sensor, thus reducing the necessary size of the top surface of the image sensor, which in turn can reduce the overall size of the image sensor. A lens assembly, including a housing and a lens, is attached to the circuit substrate to position the image sensor and the glass substrate within a cavity provided in the housing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.