Side mount feedthrough system for sealed components
US8954150B2 · kind B2 · utility
10Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2010 |
| Grant date | Feb 10, 2015 |
| Priority date | — |
| Expiry date | Apr 28, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The present subject matter provides apparatus and methods for manufacturing an encasement for a component of an implantable medical device having a main circuit board. The method includes forming an encasement aperture on a lateral side of the encasement. The lateral side of the encasement is adapted to be placed substantially parallel to a surface of the main circuit board. A feedthrough assembly is connected through the encasement aperture. The feedthrough assembly includes at least one terminal conductor at least partially passing through the encasement aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.