Method for manufacturing a micro-electro-mechanical microphone
US8955212B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2011 |
| Grant date | Feb 17, 2015 |
| Priority date | — |
| Expiry date | Jan 26, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4908
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A micro-electro-mechanical microphone and manufacturing method thereof are provided. The micro-electro-mechanical microphone includes a diaphragm, which is formed on a surface of one side of a semiconductor substrate, exposed to the outside surroundings, and can vibrate freely under the pressure generated by sound waves; an electrode plate with air holes, which is under the diaphragm; an isolation structure for fixing the diaphragm and the electrode plate; an air gap cavity between the diaphragm and the electrode plate, and a back cavity under the electrode plate and in the semiconductor substrate; and a second cavity formed on the surface of the same side of the semiconductor substrate and in an open manner The air gap cavity is connected with the back cavity through the air holes of the electrode plate The back cavity is connected with the second cavity through an air groove formed in the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.