System and methods of embedding material in a glass substrate
US8955357B2 · kind B2 · utility
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16References
21Claims
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Key dates
| Filing date | Mar 13, 2014 |
| Grant date | Feb 17, 2015 |
| Priority date | — |
| Expiry date | Mar 13, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for embedding a dopant into a glass substrate is provided. The method may include the steps of applying the dopant to a surface of the glass substrate, positioning the glass substrate adjacent to a catalyst such that the dopant is intermediate the catalyst and the glass substrate, heating the glass substrate to a first temperature, operating a directed thermal energy source so as to generate thermal energy incident upon the dopant, reducing the temperature of the glass substrate to a second temperature below the first temperature, and holding the glass substrate at the second temperature for at least a period of time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.