Wafer grounding design for single pad lapping

US8956200B2 · kind B2 · utility

Assignee

• HGST Netherlands, B.V. · NL

Inventors

• David Druist · Santa Clara, US
• Glenn P. Gee · San Jose, US
• Unal Murat Guruz · San Jose, US
• Edward Hin Pong Lee · San Jose, US
• David J. Seagle · معلمی نژاد, US
• Darrick T. Smith · San Jose, US

Key dates

• Filing date: Nov 30, 2012
• Grant date: Feb 17, 2015
• Expiry date: Aug 8, 2033

Classification

• Technology area (CPC G): Physics
• CPC primary: G11B5/3173
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 μm, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes.