Correcting current crowding in row bar and vias for single pad bonding
US8956201B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2012 |
| Grant date | Feb 17, 2015 |
| Priority date | — |
| Expiry date | Aug 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein generally relate to connecting electronic lapping guides (ELGs) to a lapping controller to prevent the effects of current crowding while reducing connections to the ELGs in single pad lapping. Devices and systems can include a row of sliders including a magnetoresistive (MR) element, a plurality of high resistance ELGs connected to both the wafer and to at least one bonding pad and at least two peripheral grounding vias connected to the wafer. Methods and systems include a wafer comprising a plurality of sliders wherein each slider is connected to a lapping controller and the delivery of current to the ELGs is sequential to groups of sliders such that only one group of ELGs is being measured at any time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.