Medical implant including a magnesium-based tie layer
US8956403B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2011 |
| Grant date | Feb 17, 2015 |
| Priority date | — |
| Expiry date | Sep 21, 2031 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61L2300/00
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A medical implant includes a metallic base, a tie layer, and at least a first layer overlying an outer surface of the tie layer. The tie layer is bonded to at least a portion of a surface of the metallic base. The tie layer includes magnesium or a magnesium-based alloy. The tie layer can have an outer surface comprising dendritic grains. The tie layer can have a rough outer surface defined by pores, projecting grain structures, and/or projecting particles. A method of producing a tie layer on a medical device includes applying magnesium or a magnesium-based alloy to the medical device and cooling the magnesium or the magnesium-based alloy to produce a rough outer surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.